Microlab 20
The MicroLab 20 is a fast and reliable micrograph laboratory for quick analysis and customisable reporting options.
It can also be integrated with other Komax quality tools such as Crimp Force Monitors, Pull Testers and Micrometers for a more comprehensive quality report.
Compared to its predecessor, the MicroLab20 is able to cut a wider range of wires, from 0.05 mm² to 80 mm².
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Description
Automatic cutting and polishing
- All-in-one cutting and polishing at press of button
- Double claw sample holder for greater perpendicularity alignment of wider range of wires
Customisable solution
- Optional vacuum module to remove fumes and dust from grinding
- Optional laser sight for more accurate cutting
Improved quality control
- Able to integrate with pull testers and micrometers for pull force and crimp width/crimp height measurements
- Customisable report templates
Technical Data | |
Cutting Module | |
Range | 0.05 – 80.00 mm2 |
Speed | 3500 rpm |
Feed Rate | ~0.6 mm/sec |
Cutting Wheel | ID: 12.7 mm, OD: 127 mm, Thickness: 0.5 mm |
Polishing Module | |
Speed | 3500 rpm |
Feed Rate | ~6 mm/sec |
Adjustable Grinding Range | 0.00 – 5.00 mm |
Adhesive Sandpaper OD | 125 mm |
Etching Module | |
Processing Time | 2 – 30 sec |
Imaging Module | |
Magnification Range | 0.75×, 1×, 1.5×, 2.0×, 2.5×, 3.0×, 3.5×, 4.0×, 4.5×, 5.0 |
Field of View | 1.2 mm – 8.2 mm (X-direction) |
Weight and Dimensions | |
Device Weight | 30 kg |
Device Dimensions | 435 × 390 × 290 mm |