| Range | 0.05 – 80.00 mm2 |
|---|---|
| Speed (Cutting Module) | 3500 rpm |
| Feed Rate (Cutting Module) | ~0.6 mm/sec |
| Cutting Wheel | ID: 12.7 mm, OD: 127 mm, Thickness: 0.5 mm |
| Speed (Polishing Module) | 3500 rpm |
| Feed Rate (Polishing Module) | ~6 mm/sec |
| Adjustable Grinding Range | 0.00 – 5.00 mm |
| Adhesive Sandpaper OD | 125 mm |
| Processing Time | 2 – 30 sec |
| Magnification Range | 0.75×, 1×, 1.5×, 2.0×, 2.5×, 3.0×, 3.5×, 4.0×, 4.5×, 5.0 |
| Field of View | 1.2 mm – 8.2 mm (X-direction) |
| Device Weight | 30 kg |
| Device Dimensions | 435 × 390 × 290 mm |
Quality Tools
MicroLab 20
The MicroLab 20 is a fast and reliable micrograph laboratory for quick analysis and customisable reporting options.
It can also be integrated with other Komax quality tools such as Crimp Force Monitors, Pull Testers and Micrometers for a more comprehensive quality report.
Compared to its predecessor, the MicroLab20 is able to cut a wider range of wires, from 0.05 mm² to 80 mm².
Interested in the MicroLab 20?
Talk to our team for pricing, availability and expert advice.
